Advanced Packaging Materials
AEMC provides Positive/Negative/Lift-off PR, Polyimide and Underfill which can be applied to advanced packaging process.
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PRODUCT |
PRODUCT FEATURES |
SUITABLE PROCESS |
APPLICATIONS |
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(1) Lift-off series |
Negative Photo-resist Lift-off type |
Spin coating Broadband/ i-line TMAH developing |
IC/ Package RDL Metal deposited by evaporation or sputtering
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(2) PPR Thick film series |
Positive Photo-resist |
Spin / Spray coating Broadband/i-line TMAH / KOH developing |
Package / MEMS RDL Cu Pillar Au bump |
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(3) NPR Thick film series |
Negative Photo-resist |
Spin coating i-line TMAH developing |
Package Au bump |
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(4) Pl series |
Positive / Negative Photo-resist PSPI (Photo sensitive polyimide) |
Spin / Spray coating Broadband/i-line TMAH developing
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Package Passivation layer |
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(5) Protection PR |
Positive type |
Spin coating i-line expose TMAH developing
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Protection IC / Package Dry / wet etching |
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(6) Pad fill series |
Negative Photo-resist Clear permanent material |
Spin coating Broadband / i-line TMAH developing |
IC / Package Pad Fill |
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(7) Underfill series |
Underfill |
Filler size adjustable Low metal Low particle Low CI |
IC / Package Underfill |
AEMC provides Positive PR which can be applied to COF process for full screen display.