AEMC Opens Applications for the 2025 AEMC Master’s Student Scholarship Program
Since 2023, AEMC has launched the Master’s Student Scholarship Program, now entering its third year. To nurture outstanding local talent in the field of semiconductor materials, this scholarship is established to support students in focusing on their studies during their academic journey.
AEMC Partners Strategically with Nan Pao and Trusval in High-End Adhesive Materials for Advanced Packaging
AEMC (TPEx 4749), Nan Pao (TWSE 4766), and Trusval (TPEx 6667) today (28th) jointly announced the establishment of Advanced Pao Trusval Technology Co., Ltd., a new joint venture aimed at entering the advanced adhesive materials market for semiconductor advanced packaging.