AEMC Partners Strategically with Nan Pao and Trusval in High-End Adhesive Materials for Advanced Packaging

AEMC (TPEx 4749), Nan Pao (TWSE 4766), and Trusval (TPEx 6667) today (28th) jointly announced the establishment of Advanced Pao Trusval Technology Co., Ltd., a new joint venture aimed at entering the advanced adhesive materials market for semiconductor advanced packaging.

The new company will have a capital of NT$500 million, with AEMC, Nan Pao, and Trusval holding 36%, 34%, and 30% of the shares, respectively.

The three parties will integrate their strengths: AEMC’s industry network and expertise in advanced specialty materials for semiconductors, Nan Pao’s core technology in adhesive synthesis, and Trusval’s capabilities in high-tech system integration and coating process development. Together, they will co-develop and promote high-end adhesive tapes for semiconductor advanced packaging.

Driven by the surging demand for AI, high-performance computing (HPC), and mobile communications—requiring massive computing power, data transmission, complex signaling, as well as stringent demands on chip size, power consumption, and performance—the semiconductor industry continues to innovate in process technologies. At the same time, highly integrated and high-performance advanced packaging has become a major growth driver for the sector. The global semiconductor process tapes market is projected to grow at a compound annual growth rate (CAGR) of 9.7%.

These types of adhesive materials play a critical role in yield and production efficiency, and their importance is even greater in advanced packaging processes. In the past, Taiwan’s semiconductor manufacturers relied heavily on overseas suppliers. This collaboration is expected to strengthen the localization of the supply chain and enhance material self-sufficiency, addressing the industry’s significant demand for high-quality adhesives. We aspire to make a significant contribution to the advancement of Taiwan’s semiconductor materials industry.

AEMC is committed by the mission of building collaborative partnerships across the upstream and downstream supply chain, strengthen Taiwan’s autonomous technologies in specialized materials for advanced semiconductor processes. Through such collaborations, we aim to enhance the global competitiveness of the local specialty materials industry, meet customer demands, improve yield, and create outstanding added value. In addition to working closely with customers to produce critical materials for advanced processes—such as Surface Modifier(Rinse), Bottom Anti-Reflective Coatings (BARC), and Edge Bead Removers (EBR)—we are also actively developing a range of front-end Lithography materials. In terms of advanced packaging materials, beyond our first-quarter investment in e-Ray Optoelectronics Technology Co., Ltd., which specializes in high-frequency adhesives used in advanced copper-clad laminates, this newly formed joint venture, Advanced Pao Trusval Technology Co., Ltd., marks our second strategic alliance.

Currently, Nan Pao has developed UV debonding adhesives for semiconductor wafer dicing and packaging. These adhesives are designed for advanced packaging processes such as laser cutting and thin-wafer separation. They feature strong adhesion while enabling rapid debonding under UV exposure, leaving no residue and thereby enhancing process efficiency and yield. At present, revenue from adhesives for semiconductors and other electronic applications accounts for around 1–2% of Nan Pao’s total revenue. With strong growth potential, the company plans to continue increasing resource allocation to this segment as a new driver of future growth.

Nan Pao CEO, Mr. Ming-Hsien Hsu, stated:“Nan Pao is actively pursuing new growth drivers, and semiconductor-related applications are one of our key target areas. Advanced packaging imposes extremely high material requirements, demanding a deep understanding of industry needs and challenges. By collaborating with two outstanding partners, AEMC and Trusval, we can accelerate product development, increase the likelihood of successful market entry, and broaden application fields. We have strong confidence in the future development of this new joint venture.”

In recent years, Trusval has been actively engaged in the development of high-k PVDF composite films. Leveraging its extensive coating experience and existing continuous coating equipment, the company has successfully applied these capabilities to the development and mass production of critical materials for passive components and energy storage units. The film thickness ranges from a few micrometers to over one hundred micrometers, featuring excellent flatness and uniformity. Even in long-term production, surface flatness can be consistently maintained within ±1 to 1.5 μm. Looking ahead, the company will continue to optimize equipment and processes, aiming to further improve surface flatness control to below ±1 μm, thereby meeting more demanding application requirements. To pursue comprehensive growth, Trusval plans to integrate Taiwan’s leading polymer adhesive R&D and manufacturing strengths, actively expanding into high-end semiconductor tape coating. Through such strategic collaborations, we not only to help advanced packaging customers enhance yield and reduce costs, but also to capture the vast opportunities in advanced semiconductor packaging. By rapidly meeting customers’ urgent demand for advanced packaging materials, we create synergistic value across the entire supply chain.

About AEMC

Founded in 2003, AEMC is dedicated to the independent research, development, and manufacturing of ithography specialty materials. Since 2018, the company has expanded from panel photoresists into the field of advanced semiconductor specialty materials. Its core products are now supplied to major semiconductor customers for use in advanced 2nm lithography processes. In addition, multiple innovative products for semiconductor optical components and displays have been validated by leading domestic manufacturers and are in stable mass production. Currently, AEMC operates R&D and manufacturing facilities in Taoyuan, Tainan, and Kaohsiung.

Looking ahead, AEMC will continue to enhance its synthesis, purification, formulation, and process technologies for advanced semiconductor specialty materials. By meeting customer needs and helping to improve yields, the company aims to deliver exceptional value, establish itself as a globally competitive innovator in specialty materials, and make a significant contribution to Taiwan’s semiconductor material self-sufficiency.

AEMC – Media Contact

Spokesperson：Sharen Lu, Senior Director 、IR & PR Division: Mina Lin

Tel：+886-3-4072100 ext.4749  |  Mobile：+886-975-53-4749  |   Email：ir@aemc.com.tw

Website：www.aemc.com.tw